Name: Precision BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template for Xiaomi Mi3 3S NOTE MI6 MIX2 RedMi NOTE
SKU: BD33033711006
Price: 5.29 USD
Availability: OutOfStock
Rating: 5 (10 reviews)

Precision BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template for Xiaomi Mi3 3S NOTE MI6 MIX2 RedMi NOTE

Precision BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template for Xiaomi Mi3 3S NOTE MI6 MIX2 RedMi NOTE

(5.0)

~~US $ 6.22~~ 14% off

US $ 5.29

Out Of Stock

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Precision BGA Reballing Stencil Kit 0.12mm Thickness Tin Mesh Solder Template for Xiaomi Mi3 3S NOTE MI6 MIX2 RedMi NOTE

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