Unfortunately, this product is no longer available.
Amaoe HI6250 CPU BGA Stencil Bottom Layer IC Reballing Chip Solder Ball Tin Plant Net Rework Heat Template Steel Mesh

Amaoe HI6250 CPU BGA Stencil Bottom Layer IC Reballing Chip Solder Ball Tin Plant Net Rework Heat Template Steel Mesh

(5.0)
US $ 2.04    3% off
US $ 1.99
Out Of Stock

Cheap And Discounts Amaoe HI6250 CPU BGA Stencil Bottom Layer IC Reballing Chip Solder Ball Tin Plant Net Rework Heat Template Steel Mesh Wholesale. Buy Directly From Merchant sfder Store. Enjoy ✓Free Shipping Worldwide! ✓90 Days Buyer Protection. ✓Easy Return. ✓Money Back Guarantee.

Recommends