Reworkable CSP encapsulant impact-resistant electronic chip underfill BGA chip solder joint protection sealant
Reworkable CSP encapsulant impact-resistant electronic chip underfill BGA chip solder joint protection sealant
Reworkable CSP encapsulant impact-resistant electronic chip underfill BGA chip solder joint protection sealant
Reworkable CSP encapsulant impact-resistant electronic chip underfill BGA chip solder joint protection sealant

Reworkable CSP encapsulant impact-resistant electronic chip underfill BGA chip solder joint protection sealant

(5.0)
US $ 54.99    57% off
US $ 23.64
In Stock
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